Semiconductor packaging and testing R&D: industry layout and capacity expansion

Definition

The global capacity layout and regional strategic adjustments in the semiconductor packaging and testing sector involve manufacturing base construction, geopolitical influences, and industrial chain collaboration.

Key Facts and TrendsAccelerating International Expansion: In September 2024, Foxconn Group announced an evaluation to establish a semiconductor packaging and testing facility in Europe, alongside concurrent investments in satellite application chips and silicon photonics technology research.

Domestic Regional Agglomeration: In 2025, China launched several new major projects, including the Tongling Qiming Semiconductor Phase II R&D industrialization project (approved in April) and the Lianyungang Lianchuang Chip Integrated Circuit Packaging and Testing Base (signed in April), the latter being the city's first semiconductor packaging and testing project.

Technology-Driven Site Selection: Domestic projects generally emphasize a dual-driven model of "R&D + manufacturing." For example, the Lianchuang Chip project explicitly includes establishing an R&D center focused on smart terminal chips.

Major DebatesLocalization vs. Globalization: The establishment of factories in Europe reflects the impact of geopolitics on supply chain, while continued domestic investment highlights the coexisting trend of global capacity shifting toward the Asia-Pacific region.