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      Your Current Position:  News
      • 2025
        08-04
        Semiconductor packaging and testing R&D: R&D investment and industrial collaboration
        Corporate R&D resource allocation, industry-university-research collaboration mechanisms, and upstream-downstream technological coordination models within the industrial chain.
      • 2025
        05-30
        Semiconductor packaging and testing R&D: talents and standards system
        Professional talent development mechanism, job competency requirements, and the formulation and application of industry technical standards.
      • 2025
        03-27
        Semiconductor Packaging and Testing R&D: Equipment and Technological Innovation
        The R&D breakthroughs and evolution of core technical routes for specialized equipment in the packaging testing phase determine industry production efficiency and process limits.
      • 2024
        07-12
        Semiconductor packaging and testing R&D: industry layout and capacity expansion
        Globalized capacity layout and regional strategic adjustments in semiconductor packaging and testing involve manufacturing base construction, geopolitical impacts, and industrial chain collaboration.

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      ‍‍EmBud Electronics Technology (Suzhou)Co.,Ltd.

      Tel:199-4186-8795

      Tel:0512-66939526-8008

      E-mail:sales@sznest.cn / marketing@sznest.cn

      Address:Building 7 & Building 9, Phase II, Shangshi Science and Technology Park, No. 26 Qinghua Road, High-tech Zone, Suzhou City, Jiangsu Province

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