Semiconductor packaging and testing R&D: R&D investment and industrial collaboration

Definition

Corporate R&D resource allocation, industry-university-research collaboration mechanisms, and upstream-downstream technological cooperation models within the industrial chain.

Key Facts and Trends

Industry leaders driving R&D: In the ranking of R&D expenditures among listed companies in the semiconductor packaging and testing sector for Q2 2024, BYD ranked first with 19.621 billion yuan, followed by professional packaging and testing firms such as JCET Group and Tongfu Microelectronics entering the top ten.

Collaborative R&D as the norm: The industry commonly adopts a technology transfer plus joint R&D model, with typical contract terms including shared intellectual property rights and confidentiality periods of 5–10 years.

Vertical integration across the supply chain: Foxconn has established a full-chain presence from IC design (automotive electronics, satellite chips) to packaging and testing, building a competitive advantage through technological synergy.

Major Debates

Independent R&D vs. technology importation: Domestic enterprises tend to "emphasize manufacturing over R&D," while specialized and innovative firms such as Jingyan Intelligent achieve differentiated competition through sustained R&D investment.