Semiconductor Packaging and Testing R&D: Equipment and Technological Innovation

Definition

Breakthroughs in the development of dedicated equipment for packaging and testing processes, along with the evolution of core technological pathways, determine industry production efficiency and process limits.

Key Facts and Trends

Equipment manufacturers' technological advancement: Jingyan Intelligent focuses on R&D of back-end packaging equipment, with core products including ATE (Automatic Test Equipment) systems and robotic loading devices, whose precision and stability have gained market recognition.

Diversification of technology routes: Leading companies are simultaneously advancing both traditional and advanced packaging technologies; for example, Foxconn is focusing on silicon photonics and CPO (Co-Packaged Optics) technology development.

Acceleration of domestic substitution: Domestic equipment suppliers have achieved breakthroughs in mid-range segments such as low-voltage electrical testing systems, yet high-end ATE equipment still relies on imports.

Data Highlights

The domestic packaging and testing equipment market is expected to exceed 20 billion RMB by 2025, maintaining a CAGR of over 15%.